Business description: Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.

Sales by Activity: Kinsus Interconnect Technology Corp.

Fiscal Period: December 2021 (TWD) 2022 (TWD) 2023 (TWD) 2024 (TWD) 2025 (TWD)

IC Substrate

27.73B 35.3B 20.04B 23.72B 32.31B

Optics

5.6B 6.32B 6.79B 6.82B 7.04B

Elimination

- - - - -158K

Printed Circuit Board (PCB)

2.34B 2.82M - - -

Geographical breakdown of sales: Kinsus Interconnect Technology Corp.

Fiscal Period: December 2021 (TWD) 2022 (TWD) 2023 (TWD) 2024 (TWD) 2025 (TWD)

Other Countries

23.13B 29.37B 20.03B 22.04B 29.26B

Taiwan

12.54B 13.07B 6.8B 8.5B 10.09B

Executive Committee: Kinsus Interconnect Technology Corp.

Manager TitleAgeSince
Chief Executive Officer - -
Director of Finance/CFO - 01/08/2000
Chief Operating Officer - -
Chief Tech/Sci/R&D Officer - 11/09/2000
Corporate Officer/Principal 65 01/11/2013

Composition of the Board of Directors: Kinsus Interconnect Technology Corp.

Director TitleAgeSince
Chairman 65 01/09/2000
Chairman - 11/09/2000
Director/Board Member - 01/09/2003
Director/Board Member - 01/09/2003
Director/Board Member - -
Director/Board Member - 11/09/2000
Director/Board Member - 18/06/2010
Director/Board Member - 01/09/2003
Director/Board Member - 01/09/2003
Director/Board Member - -

Shareholders: Kinsus Interconnect Technology Corp.

NameStocks%Valuation
34.14 %
179,895,455 34.14 % 5 032 M NT$
Fuh Hwa Securities Investment Trust Co., Ltd.
1.336 %
7,040,920 1.336 % 197 M NT$
Nomura Asset Management Taiwan Ltd.
1.149 %
6,055,388 1.149 % 169 M NT$
Uni-President Asset Management Corp.
0.852 %
4,489,108 0.852 % 126 M NT$
Neuberger Berman Taiwan Ltd.
0.309 %
1,627,999 0.309 % 46 M NT$

Holdings: Kinsus Interconnect Technology Corp.

NameStocks%Valuation
21,233,73627.22% 230 M $

Company details: Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp.

No. 1245 Zhonghua Road

327 47, Taoyuan

+

http://www.kinsus.com.tw
address Kinsus Interconnect Technology Corp.(3189)

Integrated Circuits

Change 5-day change 1-year change 3-year change Capi.($)
-10.00%-12.83%+576.10%+521.52% 12.57B
-8.92%-14.14%+139.01%+386.99% 183B
-9.97%-18.97%+49.12%+235.98% 115B
-10.00%-7.42%+381.15%+898.02% 72.33B
-9.92%-15.11%+357.27%+1,366.56% 55.4B
-12.36%-20.56% - - 52.57B
-9.98%-9.26%+485.98%+324.60% 44.83B
-6.52%-6.92%+161.30%+406.94% 38.84B
-10.86%-18.60%+55.78%+833.51% 38.28B
-8.24%-24.53%+170.38%+443.43% 36.6B
Average -9.68%-10.34%+264.01%+601.95% 64.91B
Weighted average by Cap. -9.62%-10.04%+204.66%+542.42%
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
12
Last Close Price
693.00TWD
Average target price
868.00TWD
Spread / Average Target
+25.25%

Quarterly revenue - Rate of surprise

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