STATS ChipPAC Ltd. Stock

Stocks

15/03/17	STATS ChipPAC : Achieves 1.5 Billion Unit Milestone in Fan-out Wafer Level Packaging Shipments	PU
24/01/17	STATS ChipPAC : Recognized for Patent Innovations for the Seventh Consecutive Year by IEEE	PU
11/05/16	STATS ChipPAC : Fan-out Wafer Level Packaging Shipments Exceed One Billion Units	PU
19/01/16	STATS ChipPAC : Ranked in Top 10 Semiconductor Equipment Manufacturing Companies by IEEE for Patent Innovations	MW
18/11/15	STATS ChipPAC : Announces Pricing of New Senior Secured Notes	PU

1 day

-1.08%

Manager	Title	Age	Since
Chun-Heung Lee CEO	Chief Executive Officer	67	27/09/2018
Kwek Kiong Woo DFI	Director of Finance/CFO	-	01/08/2015
Il Kwon Shim CTO	Chief Tech/Sci/R&D Officer	-	01/01/2000

Director	Title	Age	Since
Xin Chao Wang CHM	Chairman	70	06/08/2015
Kwek Kiong Woo BRD	Director/Board Member	-	01/02/2017
Ming Liu BRD	Director/Board Member	-	01/08/2015

Add to a list 0 selected To use this feature you must be a member Log in Sign up	Change	5-day change	1-year change	3-year change	Capi.($)
STATS CHIPPAC LTD.	-1.08%	-.--%	-	-	0
ASML HOLDING N.V.	+3.51%	+8.56%	+88.35%	+197.09%	715B
LAM RESEARCH CORPORATION	+2.17%	+10.24%	+136.40%	+450.80%	435B
APPLIED MATERIALS, INC.	+2.03%	+11.35%	+141.53%	+287.10%	429B
KLA CORPORATION	+3.27%	+10.09%	+81.60%	+349.15%	270B
TOKYO ELECTRON LIMITED	-3.82%	+7.04%	+117.27%	+199.80%	174B
ADVANTEST CORPORATION	+2.71%	+13.62%	+156.76%	+798.16%	177B
ASE TECHNOLOGY HOLDING CO., LTD.	+0.42%	+2.00%	+333.43%	+542.34%	98.43B
NAURA TECHNOLOGY GROUP CO., LTD.	-2.07%	-5.68%	+36.17%	+244.62%	66.67B
TERADYNE, INC.	+8.00%	+12.72%	+210.70%	+346.05%	70.2B
Average	+0.90%	+7.23%	+144.69%	+379.46%	270.55B
Weighted average by Cap.	+1.35%	+8.90%	+124.61%	+338.62%

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