Valuation: Tera Probe, Inc.

Market Cap 120B 743M 652M 601M 562M 1.05B 70.12B 1.08B 7.22B 2.79B 34.66B 2.79B 2.73B P/E 2026 *
24x
P/E 2027 * 20x
Enterprise Value 120B 743M 652M 601M 562M 1.05B 70.12B 1.08B 7.22B 2.79B 34.66B 2.79B 2.73B EV / Sales 2026 *
2.11x
EV / Sales 2027 * 1.72x
Free-Float
36.64%
Yield 2026 *
1.14%
Yield 2027 * 1.32%
1 day-3.51%
1 week+3.69%
Current month+16.29%
1 month+10.82%
3 months+62.89%
6 months+107.70%
Current year+109.68%
1 week 12,390
Extreme 12390
14,960
1 month 8,510
Extreme 8510
14,960
Current year 6,290
Extreme 6290
14,960
1 year 3,050
Extreme 3050
14,960
3 years 1,901
Extreme 1901
14,960
5 years 1,175
Extreme 1175
14,960
10 years 404
Extreme 404
14,960
Manager TitleAgeSince
Director of Finance/CFO 51 01/03/2020
President 59 26/03/2020
Chief Tech/Sci/R&D Officer 55 01/03/2020
Director TitleAgeSince
Director/Board Member 59 01/09/2005
Director/Board Member 55 01/06/2013
Director/Board Member 75 01/09/2005
Change 5-day change 1-year change 3-year change Capi.($)
-3.51%+3.69%+305.21%+287.39% 743M
-3.93%-4.21%+179.41%+421.33% 325B
-9.64%+2.21%+206.47%+627.76% 145B
-7.44%-0.24%+383.52%+296.10% 68.39B
-6.07%-6.81%+371.01% - 36.69B
+1.58%+19.24%+609.07%+584.42% 29.29B
-7.98%+4.88%+182.33%+216.81% 15.97B
+3.16%+25.09%+387.86%+353.12% 13.82B
-7.92%-0.16%+193.33%+440.35% 11.82B
+0.71%+15.04%+126.51%+144.69% 11.02B
Average -4.10%+3.34%+294.47%+374.66% 65.8B
Weighted average by Cap. -5.37%+1.10%+240.37%+452.08%

Financials

2026 *2027 *
Net sales 57B 353M 309M 285M 267M 500M 33.26B 511M 3.43B 1.33B 16.44B 1.32B 1.3B 70B 433M 380M 350M 328M 614M 40.85B 627M 4.21B 1.63B 20.19B 1.63B 1.59B
Net income 5B 30.93M 27.12M 25M 23.4M 43.88M 2.92B 44.79M 300M 116M 1.44B 116M 114M 6B 37.11M 32.54M 30M 28.08M 52.66M 3.5B 53.75M 361M 140M 1.73B 139M 136M
Net Debt - -
Logo Tera Probe, Inc.
Tera Probe Inc is a Japan-based company engaged in contract wafer testing and final testing within the semiconductor manufacturing process. The semiconductor manufacturing process is generally divided into the front-end process, where semiconductor chips are fabricated on wafers, and the back-end process, where semiconductor chips are assembled and packaged. The inspection performed in the front-end process is called wafer testing, and the inspection performed in the back-end process is called final testing. The Group undertakes both testing processes. Furthermore, the Company contributes to reducing customers' wafer test costs through contracted program development and probe card design, comprehensive support from device evaluation to mass production, and proposals for improving test efficiency.
Employees
1,127
Date Price Change Volume
26/06/26 ¥13,210.00 -3.51% 142,000
25/06/26 ¥13,690.00 +6.79% 169,600
24/06/26 ¥12,820.00 -0.23% 134,100
23/06/26 ¥12,850.00 -11.74% 211,800
22/06/26 ¥14,560.00 +14.29% 279,400
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
1
Last Close Price
13,210.00
Average target price
-

Quarterly revenue - Rate of surprise

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