![Robert H. Bond](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Profile
Robert H.
Bond worked as a VP of Engineering & Manufacturing Operations at UPEK, Inc. and as a Principal at CTU of Delaware, Inc. He received an undergraduate degree from the University of Akron in 1973.
Former positions of Robert H. Bond
| Companies | Position | End |
|---|---|---|
CTU of Delaware, Inc. | Corporate Officer/Principal | - |
UPEK, Inc.
 UPEK, Inc. Miscellaneous Commercial ServicesCommercial Services Provides biometric fingerprint security solutions | Chief Operating Officer | 20/10/2009 |
Training of Robert H. Bond
Experiences
Positions held
Active
Inactive
Listed companies
Private companies
Connections
32
1st degree connections
3
1st degree companies
Male
Female
Members of the board
Executives
Linked companies
| Private companies | 3 |
|---|---|
UPEK, Inc.
UPEK, Inc. Miscellaneous Commercial ServicesCommercial Services Provides biometric fingerprint security solutions | Commercial Services |
University of Akron
 University of Akron Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
CTU of Delaware, Inc. |
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