Valuation: Amkor Technology, Inc.

Market Cap 13.01B 11.46B 10.86B 9.8B 18.48B 1,248B 18.71B 130B 49.99B 638B 48.87B 47.8B 2,045B P/E 2026 *
20.5x
P/E 2027 * 18.5x
Enterprise Value 14.12B 12.44B 11.78B 10.64B 20.05B 1,354B 20.31B 141B 54.25B 692B 53.03B 51.87B 2,219B EV / Sales 2026 *
1.84x
EV / Sales 2027 * 1.63x
Free-Float
42.18%
Yield 2026 *
0.64%
Yield 2027 * 0.69%
1 day-1.73%
1 week-1.73%
1 month-1.73%
3 months-35.69%
6 months+5.60%
1 week 43.81
Extreme 43.807
43.81
1 month 43.81
Extreme 43.807
43.81
Current year 37.68
Extreme 37.675
73.57
1 year 37.68
Extreme 37.675
73.57
3 years 37.68
Extreme 37.675
73.57
5 years 37.68
Extreme 37.675
73.57
10 years 37.68
Extreme 37.675
73.57
Manager TitleAgeSince
Chief Executive Officer 54 01/01/2026
Director of Finance/CFO 52 12/09/2016
Chief Operating Officer - 01/08/1990
Director TitleAgeSince
Director/Board Member 70 01/02/2006
Director/Board Member 72 15/05/2019
Director/Board Member 70 01/02/2013
Change 5-day change 1-year change 3-year change Capi.($)
-1.73%-1.73% - - 13.01B
+0.41%+6.64%+90.52%+188.10% 696B
+2.92%+8.69%+133.80%+429.18% 411B
+4.13%+11.13%+142.04%+277.76% 406B
+1.49%+4.51%+73.23%+324.53% 254B
+6.47%+16.65%+143.70%+211.69% 171B
+9.78%+13.76%+156.29%+774.45% 158B
+1.00%+2.45%+332.93%+548.40% 97B
-2.07%-7.81%+36.17%+244.62% 66.64B
+2.84%+5.31%+189.32%+305.58% 62.68B
Average +2.50%+4.53%+144.22%+367.15% 258.09B
Weighted average by Cap. +2.66%+6.02%+124.90%+322.79%

Financials

2026 *2027 *
Net sales 7.67B 6.75B 6.4B 5.77B 10.88B 735B 11.02B 76.52B 29.45B 376B 28.78B 28.16B 1,205B 8.64B 7.61B 7.21B 6.51B 12.27B 828B 12.43B 86.25B 33.19B 424B 32.45B 31.74B 1,358B
Net income 641M 565M 535M 483M 910M 61.48B 922M 6.4B 2.46B 31.43B 2.41B 2.36B 101B 731M 644M 610M 551M 1.04B 70.1B 1.05B 7.3B 2.81B 35.84B 2.75B 2.69B 115B
Net Debt 1.11B 976M 925M 835M 1.57B 106B 1.59B 11.07B 4.26B 54.35B 4.16B 4.07B 174B 1.04B 915M 867M 783M 1.48B 99.65B 1.49B 10.37B 3.99B 50.94B 3.9B 3.82B 163B
Logo Amkor Technology, Inc.
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
Employees
30,800
Date Price Change
Trader
Investor
Global
Quality
ESG MSCI
BBB
Sell
Consensus
Buy
Mean consensus
OUTPERFORM
Number of Analysts
11
Last Close Price
52.38USD
Average target price
76.40USD
Spread / Average Target
+45.86%

Quarterly revenue - Rate of surprise