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Valuation: Axcelis Technologies

Market Cap 5.89B 5.08B 4.67B 4.38B 8.23B 557B 8.31B 55.22B 21.57B 273B 22.1B 21.63B 943B P/E Ratio 2026 *
78x
P/E Ratio 2027 * 50.9x
Enterprise Value 5.89B 5.08B 4.67B 4.38B 8.23B 557B 8.31B 55.22B 21.57B 273B 22.1B 21.63B 943B EV / Sales 2026 *
6.98x
EV / Sales 2027 * 6.36x
Free-Float
99.31%
Yield 2026 *
-
Yield 2027 * -
Manager TitleAgeSince
Chief Executive Officer 55 11/05/2023
Director of Finance/CFO 53 12/03/2026
Chief Operating Officer - -
Director TitleAgeSince
Director/Board Member 72 01/05/2015
Director/Board Member 69 13/05/2015
Director/Board Member 55 11/05/2023
Change 5-day change 1-year change 3-year change Capi.($)
-1.91%+5.49%+137.46%+141.16% 724B
-2.59%+15.73%+305.34%+518.01% 486B
-2.61%+28.79%+197.73%+249.06% 205B
+0.34%+9.63%+312.54%+367.98% 82.07B
0.00%+30.37%+1,820.15%+2,342.98% 33.65B
-3.58%+19.10%+219.08%+112.41% 27.03B
-3.64%+16.89%+100.69%+47.44% 24.84B
+6.49%+29.06%+347.50%+246.77% 21.18B
+0.74%+27.30%+194.11%+268.61% 17.55B
Average -0.75%+21.65%+403.84%+477.16% 180.22B
Weighted average by Cap. -1.95%+15.64%+243.34%+325.81%

Financials

2026 *2027 *
Net sales 844M 727M 669M 628M 1.18B 79.76B 1.19B 7.91B 3.09B 39.06B 3.17B 3.1B 135B 925M 797M 734M 689M 1.29B 87.44B 1.31B 8.68B 3.39B 42.82B 3.47B 3.4B 148B
Net income 71.7M 61.8M 56.88M 53.36M 100M 6.78B 101M 672M 263M 3.32B 269M 263M 11.48B 106M 91.14M 83.88M 78.68M 148M 9.99B 149M 992M 387M 4.89B 397M 388M 16.93B
Net Debt - -
Logo Axcelis Technologies
Axcelis Technologies, Inc. is primarily a producer of ion implantation equipment used in the fabrication of semiconductor chips in the United States, Europe, and Asia. The Company is focused on developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the enabling steps in the IC manufacturing process. The Company's products include High Current, Medium Energy, High Energy, Mid Current, and GSD Ovation. The Company's Purion H6 next generation high current ion implanters deliver process control by leveraging its spot beam architecture, optimized for the full spectrum of high-current applications. The Company's Purion H200 is its state-of-the-art single wafer high current medium energy implanter. Its Purion XE Series high energy ion implanters use RF Linear Accelerator (LINAC) technology. The Company's Purion M ion implanters offer the broadest spectrum of mid-current doses available.
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