Valuation: Axcelis Technologies

Market Cap 4.01B 3.48B 3.24B 2.98B 5.62B 383B 5.71B 38.22B 15B 190B 15.05B 14.72B 639B P/E 2026 *
53.1x
P/E 2027 * 34.6x
Enterprise Value 4.01B 3.48B 3.24B 2.98B 5.62B 383B 5.71B 38.22B 15B 190B 15.05B 14.72B 639B EV / Sales 2026 *
4.75x
EV / Sales 2027 * 4.33x
Free-Float
99.32%
Yield 2026 *
-
Yield 2027 * -
Manager TitleAgeSince
Chief Executive Officer 55 11/05/2023
Director of Finance/CFO 53 12/03/2026
Chief Operating Officer - -
Director TitleAgeSince
Director/Board Member 72 01/05/2015
Director/Board Member 69 13/05/2015
Director/Board Member 55 11/05/2023
Change 5-day change 1-year change 3-year change Capi.($)
-0.40%-8.24%+133.93%+119.90% 634B
-1.58%-3.99%+208.96%+307.83% 367B
+6.24%-11.43%+103.07%+161.24% 158B
+9.90%-9.46%+263.93%+384.72% 75.42B
+12.76%-12.18%+144.27%+76.53% 21.32B
+1.66%-7.82%+51.73%+8.51% 18.16B
+5.18%-20.50%+110.35%+228.55% 14.95B
+3.22%-5.15%+172.91%+108.00% 12.86B
+3.34%-23.23%+121.05%+71.43% 12.39B
Average +4.48%-11.57%+145.58%+162.97% 145.99B
Weighted average by Cap. +1.04%-7.80%+157.64%+190.97%

Financials

2026 *2027 *
Net sales 844M 734M 683M 627M 1.18B 80.56B 1.2B 8.05B 3.16B 40.11B 3.17B 3.1B 134B 925M 804M 749M 687M 1.3B 88.32B 1.32B 8.82B 3.46B 43.97B 3.47B 3.4B 147B
Net income 71.7M 62.33M 58.02M 53.27M 101M 6.84B 102M 684M 268M 3.41B 269M 263M 11.43B 106M 91.92M 85.56M 78.55M 148M 10.09B 151M 1.01B 396M 5.03B 397M 388M 16.85B
Net Debt - -
Logo Axcelis Technologies
Axcelis Technologies, Inc. is primarily a producer of ion implantation equipment used in the fabrication of semiconductor chips in the United States, Europe, and Asia. The Company is focused on developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the enabling steps in the IC manufacturing process. The Company's products include High Current, Medium Energy, High Energy, Mid Current, and GSD Ovation. The Company's Purion H6 next generation high current ion implanters deliver process control by leveraging its spot beam architecture, optimized for the full spectrum of high-current applications. The Company's Purion H200 is its state-of-the-art single wafer high current medium energy implanter. Its Purion XE Series high energy ion implanters use RF Linear Accelerator (LINAC) technology. The Company's Purion M ion implanters offer the broadest spectrum of mid-current doses available.
Employees
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Global
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Quality
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