Valuation : Chipbond Technology Corporation

Market Cap 136B 4.29B 3.7B 3.47B 3.16B 5.96B 410B 5.98B 41.13B 16.05B 207B 16.11B 15.76B 686B P/E 2026 *
32.4x
P/E 2027 * 25.8x
Enterprise Value 130B 4.12B 3.55B 3.33B 3.04B 5.72B 394B 5.74B 39.49B 15.41B 199B 15.47B 15.13B 659B EV / Sales 2026 *
5x
EV / Sales 2027 * 4.44x
Free-Float
80.56%
Yield 2026 *
1.73%
Yield 2027 * 2.49%
1 day-2.67%
1 week+16.61%
Current month+40.38%
1 month+54.01%
3 months-40.26%
6 months+233.03%
Current year+238.59%
1 week 152
Extreme 152
203
1 month 128
Extreme 128
203
Current year 50.2
Extreme 50.2
313.5
1 year 50.2
Extreme 50.2
313.5
3 years 50.2
Extreme 50.2
313.5
5 years 49.2
Extreme 49.2
313.5
10 years 40.55
Extreme 40.55
313.5
Manager TitleAgeSince
Chief Executive Officer - 14/06/2006
President - -
Director of Finance/CFO 60 16/11/2007
Director TitleAgeSince
Chairman - 11/06/1997
Director/Board Member - 14/06/2006
Director/Board Member - 14/06/2019
Change 5-day change 1-year change 3-year change Capi.($)
-2.67%+16.61%+240.49%+164.49% 4.29B
-4.57%+1.32%+24.90%+341.60% 5,253B
+0.41%+0.41%+108.62%+336.04% 1,982B
-0.74%+0.09%+24.01%+313.31% 1,755B
-0.27%-3.51%+683.85%+1,270.04% 1,054B
-4.45%-4.45%+514.50%+1,284.42% 874B
-2.33%-1.62%+186.28%+336.80% 760B
-0.88%+1.03% - - 583B
-2.85%-0.67%+267.43%+159.11% 470B
-6.33%-1.75%+72.84% - 255B
Average -2.47%+1.44%+235.88%+525.73% 1,299B
Weighted average by Cap. -2.61%+0.49%+148.74%+477.51%

Financials

2026 *2027 *
Net sales 26.06B 823M 709M 665M 607M 1.14B 78.66B 1.15B 7.89B 3.08B 39.71B 3.09B 3.02B 132B 29.16B 921M 794M 744M 679M 1.28B 88.01B 1.28B 8.83B 3.44B 44.43B 3.46B 3.38B 147B
Net income 4.17B 132M 113M 106M 97.05M 183M 12.58B 183M 1.26B 492M 6.35B 494M 483M 21.05B 5.26B 166M 143M 134M 122M 231M 15.86B 231M 1.59B 621M 8.01B 623M 610M 26.56B
Net Debt -5.44B -172M -148M -139M -127M -239M -16.43B -240M -1.65B -643M -8.3B -646M -632M -27.51B -6.53B -206M -178M -167M -152M -286M -19.7B -287M -1.98B -771M -9.95B -774M -757M -32.98B
Logo Chipbond Technology Corporation
Chipbond Technology Corp is a Taiwan-based company principally engaged in the research, development, manufacture, and distribution of electronic and semiconductor products, as well as the provision of related testing and assembling services. The Company provides products include gold bumps, solder bumps, chip on glass (COG), chip on film (COF) and flip chip and tape carrier packaging (TCP) products, among others. Its products are mainly used in the manufacture of computers, workstations, mobile phones, network products, air bag controllers, engine controlling components, automatic brake systems (ABSs), automobile air conditioners, digital cameras, watches, and liquid crystal display (LCD) monitors. The Company mainly distributes its products in Taiwan, the United States of America (the USA) and other regions.
Employees
-
Date Price Change Volume
28/08/26 NT$182.50 -2.67% 53,168,281
27/08/26 NT$187.50 +1.08% 70,931,177
26/08/26 NT$185.50 +9.76% 30,347,266
25/08/26 NT$169.00 +7.64% 22,856,434
24/08/26 NT$157.00 +0.32% 14,378,267
Trader
Investor
Global
Quality
ESG MSCI
BBB
Sell
Consensus
Buy
Mean consensus
OUTPERFORM
Number of Analysts
6
Last Close Price
182.50TWD
Average target price
230.67TWD
Spread / Average Target
+26.39%

Quarterly revenue - Rate of surprise

  1. Stock Market
  2. Stocks
  3. 6147 Stock