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Valuation: ChipMOS TECHNOLOGIES INC.

Market Cap 67.13B 2.12B 1.83B 1.69B 1.58B 2.96B 202B 3.01B 19.95B 7.78B 98.22B 7.97B 7.8B 340B P/E Ratio 2026 *
22.7x
P/E Ratio 2027 * 16.1x
Enterprise Value 70.42B 2.23B 1.92B 1.77B 1.66B 3.11B 212B 3.16B 20.93B 8.16B 103B 8.36B 8.18B 357B EV / Sales 2026 *
2.29x
EV / Sales 2027 * 2.04x
Free-Float
78.37%
Yield 2026 *
1.28%
Yield 2027 * 2.08%
Manager TitleAgeSince
Director of Finance/CFO 54 01/10/2017
President 67 17/07/1997
Corporate Officer/Principal 60 17/04/2007
Director TitleAgeSince
Chairman 67 17/07/1997
Director/Board Member 67 28/06/2007
Director/Board Member 64 03/06/2015
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 2.15B
-0.55%+7.05%+141.96%+140.64% 726B
+5.70%+19.79%+316.09%+525.88% 459B
+7.00%+22.39%+205.71%+265.63% 192B
0.00%+2.25%+311.15%+373.90% 81.88B
+17.45%+39.82%+1,820.08%+2,265.64% 28.65B
+9.77%+14.51%+230.94%+115.91% 24.62B
+11.37%+25.59%+113.00%+52.03% 22.95B
+3.07%+24.29%+315.04%+221.50% 20.52B
+6.56%+17.66%+191.94%+274.54% 16.46B
Average +6.04%+15.41%+405.10%+470.63% 174.6B
Weighted average by Cap. +3.04%+14.65%+243.74%+320.01%

Financials

2026 *2027 *
Net sales 30.69B 970M 838M 772M 723M 1.35B 92.24B 1.38B 9.12B 3.56B 44.9B 3.64B 3.56B 155B 33.32B 1.05B 910M 839M 785M 1.47B 100B 1.49B 9.9B 3.86B 48.75B 3.95B 3.87B 169B
Net income 3.01B 95.3M 82.31M 75.85M 71M 133M 9.06B 135M 896M 349M 4.41B 358M 350M 15.27B 4.26B 135M 116M 107M 100M 188M 12.81B 191M 1.27B 494M 6.24B 506M 495M 21.6B
Net Debt 3.29B 104M 89.85M 82.8M 77.5M 145M 9.89B 147M 978M 381M 4.81B 390M 382M 16.66B 797M 25.2M 21.77M 20.06M 18.78M 35.19M 2.4B 35.73M 237M 92.35M 1.17B 94.59M 92.57M 4.04B
Logo ChipMOS TECHNOLOGIES INC.
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
5,688
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