Yamaha Motor Robotics Holdings Co., Ltd. Stock

6274

JP3371700000

Semiconductor Equipment & Testing

Latest news: Yamaha Motor Robotics Holdings Co., Ltd.

12/05/20	Yamaha Motor Robotics Holdings Co., Ltd. Reports Consolidated Earnings Results for the Three Months Ended March 31, 2020; Provides Consolidated Earnings Guidance for the Six Months Ending June 30, 2020 and Fiscal Year Ending December 31, 2020	CI
22/04/20	Yamaha Motor Robotics Holdings Co., Ltd.(TSE:6274) dropped from S&P Global BMI Index	CI
10/04/20	United Managers Japan Withdraws Shareholder Proposal to Yamaha Motor Robotics	CI
10/04/20	Yamaha Motor Co., Ltd. completed the acquisition of 34.5% stake in Yamaha Motor Robotics Holdings Co., Ltd. from a group of shareholders for ¥11.5 billion.	CI
12/02/20	Yamaha Motor Robotics Holdings Co., Ltd. Announces Consolidated and Non-Consolidated Earnings Results for the Fiscal Year Ended December 31, 2019; Provides Earnings Guidance for the Six Months Ending June 30, 2020 and Full Year Ending December 31, 2020	CI
12/02/20	Yamaha Motor Co., Ltd. made an offer to acquire the remaining 41.01% stake in Yamaha Motor Robotics Holdings Co., Ltd. from a group of shareholders for ¥13.6 billion.	CI
07/08/19	Yamaha Motor Robotics Holdings Co., Ltd. Reports Consolidated Earnings Results for the Three Months Ended June 30, 2019; Provides Earnings Guidance for the Fiscal Year Ending December 31, 2019	CI
27/06/19	Shinkawa Ltd. completed the acquisition of 92.79% stake in Apic Yamada Corporation from Hachijuni Capital Co., Ltd., The Hachijuni Bank, Ltd., Toshihiko Tabata, APIC Yamada employee stock ownership, client of KGI ASIA LIMITED and other shareholders for ¥6.9 billion.	CI
24/06/19	Shinkawa Ltd. announced that it has received ¥10.0000342 billion in funding from Yamaha Motor Co., Ltd.	CI
09/05/19	Shinkawa Ltd. Reports Consolidated and Non-Consolidated Earnings Results for the Year Ended March 31, 2019 and Consolidated Earnings Results for the Fourth Quarter Ended March 31, 2019; Provides Consolidated Earnings Guidance for the First Quarter Ending June 30, 2019	CI
12/02/19	Shinkawa Ltd. Provides Earnings Guidance for the Year Ending March 31, 2019	CI
12/02/19	Shinkawa Ltd. announced that it expects to receive ¥10.0000342 billion in funding from Yamaha Motor Co., Ltd.	CI
12/02/19	Shinkawa Ltd. signed an agreement to acquire Apic Yamada Corporation from Hachijuni Capital Co., Ltd., The Hachijuni Bank, Ltd., Toshihiko Tabata, APIC Yamada employee stock ownership, client of KGI ASIA LIMITED and other shareholders for ¥7.4 billion.	CI

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Managers and Directors: Yamaha Motor Robotics Holdings Co., Ltd.

Manager	Title	Age	Since
Osamu Ishioka PSD	President	67	27/06/2019

Director	Title	Age	Since
Takuya Mori BRD	Director/Board Member	66	01/06/2014
Yuichi Kawakami BRD	Director/Board Member	76	01/06/2016
Toshizumi Kato CHM	Chairman	68	01/06/2019

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Semiconductor Machinery Manufacturing

Add to a list 0 selected To use this feature you must be a member Log in Sign up	Change	5-day change	1-year change	3-year change	Capi.($)
YAMAHA MOTOR ROBOTICS HOLDINGS CO., LTD.	+0.13%	-.--%	-	-	308M
APPLIED MATERIALS, INC.	+5.19%	+10.29%	+151.08%	+270.43%	386B
NAURA TECHNOLOGY GROUP CO., LTD.	-0.78%	-7.04%	+38.90%	+251.88%	68.52B
ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA	+0.09%	-8.14%	+66.87%	+221.44%	46.05B
ASM INTERNATIONAL N.V.	+4.24%	+7.12%	+79.47%	+125.60%	47.27B
DISCO CORPORATION	+4.19%	+8.13%	+21.37%	+112.40%	37.49B
PIOTECH INC.	+0.44%	-9.52%	+162.47%	+308.00%	28.18B
GLOBALFOUNDRIES INC.	+0.17%	-1.46%	+34.48%	-18.33%	26.22B
ACM RESEARCH (SHANGHAI), INC.	+6.09%	+3.39%	+64.51%	+157.63%	20.54B
HWATSING TECHNOLOGY CO., LTD.	-0.53%	-9.55%	+99.88%	+278.17%	17.28B
Average	+1.92%	-0.36%	+79.89%	+189.69%	75.32B
Weighted average by Cap.	+3.61%	+3.77%	+113.89%	+233.56%

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Yamaha Motor Robotics Holdings Co., Ltd., formerly SHINKAWA LTD. is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment for semiconductors makers and electronic components makers. The Company is engaged in the research, manufacture and sale of bonding devices, such as wire bonders, die bonders, flip chip bonders and other semiconductor manufacturing equipment. The Company also provides related services including installment, fixing, maintenance and repair services for its products.

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Semiconductor Equipment & Testing

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