Valuation: Strasbaugh

Market Cap 10M 8.69M 8.09M 7.43M 14.03M 955M 14.25M 95.37M 37.43M 475M 37.56M 36.73M 1.59B P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 8.76M 7.61M 7.09M 6.51M 12.29M 836M 12.48M 83.55M 32.79M 416M 32.9M 32.18M 1.4B EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
5 years 0
Extreme 0
0.01
10 years 0
Extreme 0
0.51
Manager TitleAgeSince
Chief Executive Officer 76 01/05/2007
Director TitleAgeSince
Chairman 76 01/05/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 14
+1.18%-5.33%+181.94%+234.90% 398B
+2.83%-9.25%+104.95%+226.76% 71.69B
-0.72%-11.45%+159.37%+258.89% 49.08B
+1.60%-6.77%+87.42%+85.14% 44.47B
+12.74%-3.96%+28.39%+119.52% 35.28B
+3.58%-15.93%+289.87%+341.29% 27.47B
+0.20%-6.61%+33.70%-21.51% 27.37B
-4.21%-2.62%+225.67%+298.37% 19.57B
+3.72%-9.37%+117.56%+163.26% 18.69B
Average +2.09%-10.69%+136.54%+189.62% 69.2B
Weighted average by Cap. +1.81%-11.42%+156.38%+214.19%

Financials

2008 2009
Net sales 9.55M 8.31M 7.73M 7.1M 13.4M 912M 13.61M 91.12M 35.76M 454M 35.88M 35.09M 1.52B 12.87M 11.19M 10.42M 9.56M 18.06M 1.23B 18.34M 123M 48.19M 612M 48.35M 47.28M 2.05B
Net income -4.51M -3.92M -3.65M -3.35M -6.32M -430M -6.42M -43M -16.87M -214M -16.93M -16.56M -718M -680K -591K -550K -505K -954K -64.91M -969K -6.49M -2.55M -32.32M -2.55M -2.5M -108M
Net Debt -0.19 -0.16 -0.15 -0.14 -0.26 -17.95 -0.27 -1.79 -0.7 -8.93 -0.71 -0.69 -29.96 -1.24 -1.08 -1 -0.92 -1.74 -118.37 -1.77 -11.83 -4.64 -58.93 -4.66 -4.55 -197.6
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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