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Valuation: Strasbaugh

Market Cap 10M 8.74M 8.08M 7.54M 14.16M 945M 14.27M 96.05M 37.37M 465M 37.54M 36.73M 1.61B P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 8.76M 7.65M 7.08M 6.61M 12.41M 828M 12.5M 84.14M 32.74M 407M 32.89M 32.18M 1.41B EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
5 years 0
Extreme 0
0.2
10 years 0
Extreme 0
0.51
Manager TitleAgeSince
Chief Executive Officer 76 01/05/2007
Director TitleAgeSince
Chairman 76 01/05/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 14
+3.74%+12.86%+277.78%+368.41% 490B
+3.32%+11.66%+135.67%+241.05% 77.21B
+1.17%+6.31%+111.90%+181.28% 59.8B
+4.22%+10.74%+141.16%+278.85% 57.1B
+3.54%+22.64%+223.63%+251.51% 49.83B
+4.47%+10.19%+139.31%+50.86% 47.07B
+1.91%+15.94%+410.59%+306.18% 30.52B
+3.39%+1.04%+160.09%+222.17% 28.13B
-0.69%+23.46%+243.51%+235.42% 26.98B
Average +2.50%+8.38%+204.85%+237.30% 86.66B
Weighted average by Cap. +3.38%+10.41%+233.82%+303.20%

Financials

2008 2009
Net sales 9.55M 8.35M 7.72M 7.21M 13.53M 903M 13.63M 91.76M 35.7M 444M 35.87M 35.09M 1.54B 12.87M 11.25M 10.4M 9.71M 18.23M 1.22B 18.36M 124M 48.11M 598M 48.33M 47.28M 2.08B
Net income -4.51M -3.94M -3.64M -3.4M -6.38M -426M -6.43M -43.3M -16.85M -209M -16.93M -16.56M -728M -680K -594K -550K -513K -963K -64.26M -970K -6.53M -2.54M -31.59M -2.55M -2.5M -110M
Net Debt -0.19 -0.16 -0.15 -0.14 -0.27 -17.77 -0.27 -1.81 -0.7 -8.73 -0.71 -0.69 -30.34 -1.24 -1.08 -1 -0.94 -1.76 -117.18 -1.77 -11.91 -4.63 -57.61 -4.66 -4.55 -200.15
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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