Profile
Jung Sheng Li is currently the President of Kun Hong Business Co. Ltd. Prior to this, he worked as a Director at Chipbond Technology Corp.
from 1997 to 2012.
He obtained an undergraduate degree from Fu Jen Catholic University.
Jung Sheng Li active positions
| Companies | Position | Start |
|---|---|---|
Kun Hong Business Co. Ltd.
Kun Hong Business Co. Ltd. Auto Parts: OEMProducer Manufacturing Manufactures and exports auto parts and accessories | President | - |
Former positions of Jung Sheng Li
| Companies | Position | End |
|---|---|---|
| CHIPBOND TECHNOLOGY CORPORATION | Director/Board Member | - |
Training of Jung Sheng Li
Experiences
Positions held
Active
Inactive
Listed companies
Private companies
Connections
1st degree connections
1st degree companies
Male
Female
Members of the board
Executives
Linked companies
| Private companies | 3 |
|---|---|
Chipbond Technology Corp.
Chipbond Technology Corp. SemiconductorsElectronic Technology Manufactures and distributes wafer bumps, chips, and other electronic components | Electronic Technology |
Kun Hong Business Co. Ltd.
Kun Hong Business Co. Ltd. Auto Parts: OEMProducer Manufacturing Manufactures and exports auto parts and accessories | Producer Manufacturing |
Fu Jen Catholic University
Fu Jen Catholic University Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
- Stock Market
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- Jung Sheng Li
















