Valuation: Kinsus Interconnect Technology Corp.

Market Cap 496B 15.21B 13.6B 12.58B 11.39B 21.33B 1,447B 21.68B 151B 59.9B 757B 57.09B 55.87B 2,397B P/E 2026 *
74.7x
P/E 2027 * 32.1x
Enterprise Value 503B 15.44B 13.8B 12.77B 11.56B 21.64B 1,469B 22B 154B 60.79B 768B 57.94B 56.7B 2,432B EV / Sales 2026 *
9.3x
EV / Sales 2027 * 6.06x
Free-Float
60.38%
Yield 2026 *
0.6%
Yield 2027 * 1.46%
1 day-4.56%
1 week-4.18%
Current month-2.99%
1 month-2.18%
3 months+32.35%
6 months+78.90%
Current year+491.82%
1 week 928
Extreme 928
1,065
1 month 928
Extreme 928
1,150
Current year 151.5
Extreme 151.5
1,150
1 year 125.5
Extreme 125.5
1,150
3 years 60.8
Extreme 60.8
1,150
5 years 60.8
Extreme 60.8
1,150
10 years 30.3
Extreme 30.3
1,150
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 01/05/2022
Director of Finance/CFO - 01/08/2000
Director TitleAgeSince
Director/Board Member 65 01/09/2000
Chairman - 11/09/2000
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
-4.56%-4.18%+548.97%+878.17% 15.94B
+0.92%+0.66%+13.79%+438.04% 5,216B
+0.63%-0.83%+65.52%+351.98% 1,897B
+4.06%+2.57%-5.27%+309.09% 1,571B
+3.00%+4.03%+323.53%+1,319.92% 1,022B
+5.24%+4.53%+115.25%+479.64% 867B
+5.18%+5.01%+162.94%+1,017.50% 700B
+3.67%+2.31%+137.26%+163.96% 475B
+0.80%+3.56% - - 434B
+3.23%+10.74%+81.58%+114.94% 272B
Average +2.20%+0.63%+160.40%+563.69% 1,247B
Weighted average by Cap. +2.12%-0.16%+68.87%+501.70%

Financials

2026 *2027 *
Net sales 54.11B 1.66B 1.48B 1.37B 1.24B 2.33B 158B 2.37B 16.53B 6.54B 82.61B 6.23B 6.1B 262B 82.89B 2.54B 2.27B 2.1B 1.9B 3.57B 242B 3.62B 25.32B 10.01B 127B 9.54B 9.34B 401B
Net income 6.64B 204M 182M 168M 152M 285M 19.37B 290M 2.03B 802M 10.13B 764M 748M 32.08B 16.01B 491M 439M 406M 368M 688M 46.72B 700M 4.89B 1.93B 24.44B 1.84B 1.8B 77.37B
Net Debt 7.39B 227M 203M 188M 170M 318M 21.57B 323M 2.26B 893M 11.28B 851M 833M 35.72B 6.67B 205M 183M 169M 153M 287M 19.47B 292M 2.04B 806M 10.18B 768M 752M 32.24B
Projected Income Statement - Annual - Kinsus Interconnect Technology Corp.
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
27/10/26 NT$941.00 -4.56% 19,590,100
22/10/26 NT$986.00 -2.38% 19,629,047
21/10/26 NT$1,010.00 +6.88% 21,361,332
20/10/26 NT$945.00 -3.77% 12,630,519
Trader
Investor
Global
Quality
ESG MSCI
B
MarketScreener Ratings - Kinsus Interconnect Technology Corp.
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
941.00TWD
Average target price
1,156.38TWD
Spread / Average Target
+22.89%

Quarterly revenue - Rate of surprise

Rate of surprise - Net sales - Quarterly - Kinsus Interconnect Technology Corp.
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