ETFs Kinsus Interconnect Technology Corp.

3189

TW0003189007

Semiconductors

End-of-day quote Taiwan S.E. Other stock markets 17/06/2026			5-day change	1st Jan Change
706.00 ^TWD	+9.97%		+6.97%	+344.03%

06-08	Masterlink Securities Upgrades Kinsus Interconnect Technology to Buy from Hold; Price Target is NT$1,000	MT
05-22	AMD ramping up Taiwan capacity as global CPU market tightens	RE

Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.

Employees

Sector

Semiconductors

Calendar

07-02 - Ex-dividend date - 1.51756 TWD

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